1. Situation : When the speed is up to 1 8SM/M, the paper edge appears about 6 cm badly bonded (Figure 1).
2. improve:
(1) About 4 cm after the first improvement (Figure 2).
(2) About 1 cm of bad fit after the second improvement (Figure 3).
(3) Good fit after the third improvement (Figure 4).
(4) Good fit after the fourth improvement (Figure 5).
3. Main improvement points:
(1) Increase the pressure on the hot plate belt to increase the thermal conductivity and accelerate the drying of the paste.
(2) Efficient use of preheaters for more thermal energy.
(3) Properly reduce the amount of paste and speed up the speed of board bonding.
Excerpted from China Packaging News
