Bookbinding hot melt adhesive

6 major technical performance characteristics of epoxy glue

1. Low shrinkage of glue

Epoxy has a tight molecular arrangement, no separation of low molecular weights during curing, and it can be formulated as a solvent-free adhesive, so its shortening rate is usually low. If the proper packing is selected, the shortening rate can be reduced to 0.1-0.2%.

2. Strong corrosion resistance

Loctite epoxy resin structure in the presence of stable benzene ring, ether bond and solidified structure after curing, the resolution of the epoxy adhesive has a strong resistance to atmospheric, moist, chemical media, bacteria and other effects, so it can be used in many In a more demanding environment.

3. Good technical performance

Depending on the type of curing agent chosen, epoxy adhesives can be cured at room, medium or high temperatures, respectively. Usually only 0.1-0.5MPa contact pressure is required for curing. Most epoxy adhesives do not contain solvents and are easy to handle. Usually the epoxy adhesive construction viscosity, application period and curing speed can be adjusted by formula, satisfying various requests. This not only makes it easy to ensure the bonding quality but also simplifies the curing technology and equipment.

4. Outstanding electrical insulation performance

After the epoxy cures, excellent electrical insulation is achieved:

Breakdown voltage ≥35kV/mm

Volume resistance ≥1015Ω?cm

Dielectric constant 3～4(50Hz)

Arc resistance 100～140s

5. Adaptability

Epoxy adhesives change their composition (curing agents, tougheners, fillers, etc.) to obtain a range of adhesive formulations with different functions, to adapt to a variety of different needs, and with many modifiers (such as phenolic resin, Nitrile rubber, etc.) are mixed to produce various types of functions. 6. High heat resistance, low water absorption

The operating temperature of bisphenol A epoxy resin is usually from -60 to +175°C, sometimes up to 200°C. If a new epoxy resin with high or low temperature resistance is used, the operating temperature can be higher or lower, and the ring can be used. Oxygen resin has low water absorption.