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hot melt adhesive

November 17, 2018

TOKYO, Japan (Reuters) - Tsubaki Pencil (Headquarters: Tokyo) will launch a ballpoint pen type liquid glue "AQUAPiT PenType" that can bond metal, glass, and resin products on paper on July 7, 2008 (Figure 1). The adhesive composition is more than ten mPa?s, and the nano-sized polymer particles are dispersed in the water to form a low-viscosity suspension, so that the glue can smoothly flow out from the nib with a diameter of 1 mm. The price is 189 yen (tax included).

The product injects 0.9g of glue into the ballpoint pen cartridge. When the pen tip is pressed on the paper, the glue can flow out, and the glue can be applied in a spot shape of about 1 mm in diameter or in a line shape of about 1 mm in width. When not in use, the coil spring presses the ball at the front end inward to seal it.

The adhesive component is a water-soluble urethane resin suspension. It has high affinity with inorganic materials such as metals and glass. Therefore, the role of the molecular force is strong, and it is possible to bond an article that cannot be sufficiently adhered with a conventional office glue. Since a self-crosslinking design is performed at room temperature, a cross-linking reaction occurs as moisture evaporates to form an adhesive film. Can support a variety of surface morphology.

Because the viscosity of the glue is low, it is easy to spread on the object to be bonded and adhere to the object by the anchoring effect. On the metal, glass, and plastic items, "the strength at which the paper breaks when peeled off" is achieved. The product is weakly alkaline, and even if it is stored for a long time, the object to be bonded is not easily yellowed or aged. Complies with child safety standards - European toy safety regulations EN71-PART3.

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